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Applied Materials strikes NEXX deal as AI chip packages shift to larger panels
Applied Materials (AMAT) announced its acquisition of ASMPT’s NEXX business to enhance its advanced packaging portfolio, specifically targeting larger AI accelerator packages. This deal adds NEXX’s large-area electrochemical deposition (ECD) tools, expanding Applied Materials’ capabilities to support panel form factors up to 510x515 mm for advanced AI chiplet stacking. The transaction is expected to close within several months, with the NEXX team integrating into Applied’s Semiconductor Products Group in Billerica, Massachusetts.